| 型号 | 规格书 | 品牌 | 容量 | 架构 | 速率 | 工作电压 | 工作温度 | 产品详情 | 
                               
                               
                            
                            
                              
                               
                                                                 
                                    | KLM8G1GESD-B04P |  | KLM8G1GESD-B04P | eMMC | SAMSUNG/三星 | 8GB |  |  | 1.8/3.3V |  -40℃~85℃ | BGA-153 | Mass Production |  | 11.5mm x 13mm x 0.8mm |  |  | 5.1 |  | HS400 |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | 点击查看 | 
                                
                                                                
                                    | KLM8G1GEUF-B04P |  | KLM8G1GEUF-B04P | eMMC | SAMSUNG/三星 | 8GB |  |  | 1.8/3.3V |  -40℃~85℃ | FBGA-153 | Mass Production |  | 11.5mm x 13mm x 0.8mm |  |  | 5.1 |  | HS400 |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | 点击查看 | 
                                
                                                                
                                    | KLM8G1WEMB-B031 |  | KLM8G1WEMB-B031 | eMMC | SAMSUNG/三星 | 8GB |  |  | 2.7V~3.6V |  -25°C~85°C | FBGA-153 |  |  | 11.5mm x 13mm x 0.8mm |  |  | 5.0 |  | HS400 |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | 点击查看 | 
                                
                                                                
                                    | KLM8G1WEPD-B031 |  | KLM8G1WEPD-B031 | eMMC | SAMSUNG/三星 | 8GB |  |  | 1.8/3.3V |  -25°C~85°C | BGA-153 | Archived |  | 11.5mm x 13mm x 0.8mm |  |  | 5.0 |  | HS400 |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | 点击查看 | 
                                
                                                                
                                    | KLMAG1JENB-B041 |  | KLMAG1JENB-B041 | eMMC | SAMSUNG/三星 | 16GB |  |  | 1.8/3.3V |  -25°C~85°C | BGA-153 | Archived |  | 11.5mm x 13mm x 0.8mm |  |  |  5.1 |  | HS400 |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | 点击查看 | 
                                
                                                                
                                    | KLMAG2GESD-B04P |  | KLMAG2GESD-B04P | eMMC | SAMSUNG/三星 | 16Gb |  |  | 1.8/3.3V |  -40℃~85℃ | FBGA-153 | Mass Production |  | 11.5mm x 13mm x 0.8mm |  |  |  5.1 |  | hS400 |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | 点击查看 | 
                                
                                                                
                                    | KLMAG2GESD-B04Q |  | KLMAG2GESD-B04Q | eMMC | SAMSUNG/三星 | 16GB |  |  | 1.8/3.3V |  -40℃~105℃ | FBGA-153 | Mass Production |  | 11.5mm x 13mm x 0.8mm |  |  |  5.1 |  | HS400 |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | 点击查看 | 
                                
                                                                
                                    | KLMBG4GE4A-A001 |  | KLMBG4GE4A-A001 | eMMC | SAMSUNG/三星 | 32GB |  |  | 2.7V~3.6V |  -25°C~85°C | FBGA-169 |  |  | 12mm x 16mm x 1.0mm |  |  | 4.41 |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | 点击查看 | 
                                
                                                                
                                    | KLMBG4GEND-B031 |  | KLMBG4GEND-B031 | eMMC | SAMSUNG/三星 | 32GB |  |  | 1.8/3.3V |  -25°C~85°C | FBGA-153 | Archived |  | 11.5mm x 13mm x 1.0mm |  |  | 5.0 |  | HS400 |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | 点击查看 | 
                                
                                                                
                                    | KLMBG4GESD-B03P |  | KLMBG4GESD-B03P | eMMC | SAMSUNG/三星 | 32GB |  |  | 1.8/3.3V |  -40℃~85℃ | BGA-153 | Mass Production |  | 11.5mm x 13mm x 1.0mm |  |  | 5.0 |  | HS400 |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | 点击查看 | 
                                
                                                                
                                    | KLMBG4GESD-B04P |  | KLMBG4GESD-B04P | eMMC | SAMSUNG/三星 | 32GB |  |  | 1.8/3.3V |  -40℃~85℃ | BGA | Mass Production |  | 11.5mm x 13mm x 1.0mm |  |  | 5.1 |  | HS400 |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | 点击查看 | 
                                
                                                                
                                    | KLMBG4GESD-B04Q |  | KLMBG4GESD-B04Q | eMMC | SAMSUNG/三星 | 32GB |  |  | 1.8/3.3V |  -40℃~85℃ | FBGA-153 | Mass Production |  | 11.5mm x 13mm x 1.0mm |  |  | 5.1 |  | HS400 |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | 点击查看 | 
                                
                                                                
                                    | KLMBG4GEUF-B04P |  | KLMBG4GEUF-B04P | eMMC | SAMSUNG/三星 | 32GB |  |  | 1.8/3.3V |  -40℃~85℃ | FBGA-153 | Mass Production |  | 11.5mm x 13mm x 0.8mm |  |  | 5.1 |  | HS400 |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | 点击查看 | 
                                
                                                                
                                    | KLMCG2KETM-B041 |  | KLMCG2KETM-B041 | eMMC | SAMSUNG/三星 | 64GB |  |  | 1.8/3.3V |  -25°C~85°C | BGA-153 | Archived |  | 11.5mm x 13mm x 1.0mm |  |  | 5.1 |  | HS400 |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | 点击查看 | 
                                
                                                                
                                    | KLMCG2UCTB-B041 |  | KLMCG2UCTB-B041 | eMMC | SAMSUNG/三星 | 64GB |  |  | 1.8/3.3V |  -25°C~85°C | BGA-153 | Mass Production |  | 11.5mm x 13mm x 0.8mm |  |  | 5.1 |  | HS400 |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | 点击查看 | 
                                
                                                                
                                    | KLMCG8GESD-B04P |  | KLMCG8GESD-B04P | eMMC | SAMSUNG/三星 | 64GB |  |  | 1.8/3.3V |  -40℃~85℃ | FBGA-153 | Mass Production |  | 11.5mm x 13mm x 1.0mm |  |  | 5.1 |  | HS400 |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | 点击查看 | 
                                
                                                                
                                    | KLMDG4UCTA-B041 |  | KLMDG4UCTA-B041 | eMMC | SAMSUNG/三星 | 128GB |  |  | 1.8/3.3V |  -25°C~85°C | FBGA-153 | EOL |  | 11.5mm x 13mm x 1.0mm |  |  | 5.1 |  | HS400 |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | 点击查看 | 
                                
                                                                
                                    | KLMDG8JENB-B041 |  | KLMDG8JENB-B041 | eMMC | SAMSUNG/三星 | 128GB |  |  | 1.8/3.3V |  -25°C~85°C | BGA-153 | Archived |  | 11.5mm x 13mm x 1.2mm |  |  | 5.1 |  | HS400 |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | 点击查看 | 
                                
                                                                
                                    | KLMDG8JEUD-B04Q |  | KLMDG8JEUD-B04Q | eMMC | SAMSUNG/三星 | 128GB |  |  | 1.8/3.3V |  -40℃~105℃ | FBGA-153 | Mass Production |  | 11.5mm x 13mm x 1.2mm |  |  | 5.1 |  | HS400 |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | 点击查看 | 
                                
                                                                
                                    | KLMCG4JETD-B041 |  | KLMCG4JETD-B041 | eMMC | SAMSUNG/三星 | 64GB |  |  | 1.8/3.3V |  -25°C~85°C | FBGA-153 | Mass Production |  | 11.5mm x 13mm x 1.0mm |  |  | 5.1 |  | HS400 |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  |  | 点击查看 |