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型号
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规格书
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品牌
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容量
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架构
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速率
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工作电压
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工作温度
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产品详情
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THGBMUG6C1LBAIL |
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THGBMUG6C1LBAIL |
eMMC |
Toshiba/KIOXIA东芝/铠侠 |
8GB |
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400mb/s |
2.7V~3.6V |
-25℃~85℃ |
BGA-153 |
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11.5mm×13.0mm×0.8mm |
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5.1 |
15nm |
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点击查看 |
THGBMUG7C1LBAIL |
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THGBMUG7C1LBAIL |
eMMC |
Toshiba/KIOXIA东芝/铠侠 |
16GB |
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400mb/s |
2.7V~3.6V |
-25℃~85℃ |
BGA-153 |
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11.5mm×13.0mm×0.8mm |
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5.1 |
15nm |
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点击查看 |
THGBMUG8C2LBAIL |
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THGBMUG8C2LBAIL |
eMMC |
Toshiba/KIOXIA东芝/铠侠 |
32GB |
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400mb/s |
2.7V~3.6V |
-25℃~85℃ |
BGA-153 |
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11.5mm×13.0mm×0.8mm |
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5.1 |
15nm |
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点击查看 |
THGBMVG7T13BAIL |
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THGBMVG7T13BAIL |
eMMC |
Toshiba/KIOXIA东芝/铠侠 |
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BGA |
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点击查看 |
THGBMVG8T13BAIL |
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THGBMVG8T13BAIL |
eMMC |
Toshiba/KIOXIA东芝/铠侠 |
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BGA |
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点击查看 |
THGBMHG6C1LBAIL |
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THGBMHG6C1LBAIL |
eMMC |
Toshiba/KIOXIA东芝/铠侠 |
8GB |
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2.7V~3.6V |
-25℃~85℃ |
BGA-153 |
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11.5mm×13.0mm×0.8mm |
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15nm |
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点击查看 |
H26M41204HPR |
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H26M41204HPR |
eMMC |
SK HYNIX/海力士 |
8GB |
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FBGA-153 |
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11.5mm×13mm×0.8mm |
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5.1 |
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点击查看 |
H26M41208HPR |
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H26M41208HPR |
eMMC |
SK HYNIX/海力士 |
8GB |
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FBGA |
Mass production |
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11.5mm×13mm×0.8mm |
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5.1 |
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64Gb |
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EE510 |
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点击查看 |
H26M51002KPR |
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H26M51002KPR |
eMMC |
SK HYNIX/海力士 |
16GB |
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FBGA-96 |
Mass production |
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11.5mm×13mm×0.8mm |
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5.1 |
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128Gb |
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EG510 |
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点击查看 |
H26M52208FPRN |
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H26M52208FPRN |
eMMC |
SK HYNIX/海力士 |
16GB |
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3.3V/1.8V |
-25℃~85℃ |
BGA-153 |
Mass production |
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5.1 |
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EE510A |
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点击查看 |
H26M62002JPR |
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H26M62002JPR |
eMMC |
SK HYNIX/海力士 |
32GB |
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FBGA-153 |
Mass production |
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11.5mm×13mm×0.8mm |
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5.1 |
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128Gb |
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EG510 |
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点击查看 |
H26M41208HPRN |
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H26M41208HPRN |
eMMC |
SK HYNIX/海力士 |
8Gb |
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3.3V/1.8V |
-25℃~85℃ |
FBGA-153 |
Mass Production |
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5.1 |
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点击查看 |
KLMBG2JETD-B041 |
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KLMBG2JETD-B041 |
eMMC |
SAMSUNG/三星 |
32GB |
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1.8/3.3V |
-25°C~85°C |
BGA-153 |
Mass Production |
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11.5mm x 13mm x 0.8mm |
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5.1 |
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HS400 |
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点击查看 |
KLM8G1GETF-B041 |
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KLM8G1GETF-B041 |
eMMC |
SAMSUNG/三星 |
8GB |
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1.8~3.3V |
-25°C~85°C |
FBGA-153 |
Mass Production |
1120/TRAY |
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5.1 |
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HS400 |
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点击查看 |
KLMAG1JETD-B041 |
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KLMAG1JETD-B041 |
eMMC |
SAMSUNG/三星 |
16GB |
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1.8~3.3V |
-25°C~85°C |
FBGA-153 |
Mass Production |
1120/TRAY |
11.5mm*13mm*0.8mm |
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5.1 |
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HS400 |
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点击查看 |
KLM4G1FETE-B041 |
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KLM4G1FETE-B041 |
eMMC |
SAMSUNG/三星 |
4GB |
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1.8~3.3V |
-25°C~85°C |
FBGA-153 |
Mass Production |
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11mm x 10mm x 0.8mm |
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5.1 |
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HS400 |
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点击查看 |
KLM8G1GEAC-B001 |
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KLM8G1GEAC-B001 |
eMMC |
SAMSUNG/三星 |
8GB |
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2.7V~3.6V |
-25°C~85°C |
FBGA-153 |
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11.5mm x 13mm x 1.0mm |
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4.5 |
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HS200 |
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点击查看 |
KLM8G1GEME-B041 |
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KLM8G1GEME-B041 |
eMMC |
SAMSUNG/三星 |
8GB |
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1.8/3.3V |
-25°C~85°C |
FBGA-153 |
Archived |
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11.5mm x 13mm x 0.8mm |
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5.1 |
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HS400 |
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点击查看 |
KLM8G1GESD-B03P |
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KLM8G1GESD-B03P |
eMMC |
SAMSUNG/三星 |
8GB |
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1.8/3.3V |
-40℃~85℃ |
FBGA-153 |
Mass Production |
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11.5mm x 13mm x 0.8mm |
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5.0 |
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HS400 |
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点击查看 |
KLM8G1GESD-B03Q |
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KLM8G1GESD-B03Q |
eMMC |
SAMSUNG/三星 |
8GB |
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1.8/3.3V |
-40℃~105℃ |
FBGA-153 |
Mass Production |
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11.5mm x 13mm x 0.8mm |
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5.0 |
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HS400 |
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点击查看 |
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