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型号

规格书

DRAM类型

容量

架构

速率

工作电压

工作温度

产品详情

K4U6E3S4AA-MGCL

K4U6E3S4AA-MGCL

DRAM LPDDR4X

SAMSUNG/三星

16Gb

x32

4266Mbps

1.8/1.1/0.6V

-25°C~85°C

FBGA-200

Mass Production

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K3UH7H70AM-JGCR

K3UH7H70AM-JGCR

DRAM LPDDR4X

SAMSUNG/三星

64Gb

x64

4266Mbps

1.8/1.1/0.6V

-25°C~85°C

FBGA-432

Sample

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K4U8E3S4AD-GFCL

K4U8E3S4AD-GFCL

DRAM LPDDR4X

SAMSUNG/三星

8Gb

x32

4266Mbps

1.8/1.1/0.6V

-40°C~95°C

FBGA-200

Mass Production

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K4FBE3D4HM-MGCJ

K4FBE3D4HM-MGCJ

DRAM DDR4

SAMSUNG/三星

32Gb

x32

3733Mbps

1.8/1.1/1.1V

-25°C~85°C

FBGA-200

Mass Production

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K4F8E3S4HD-GFCL

K4F8E3S4HD-GFCL

DRAM DDR4

SAMSUNG/三星

8Gb

x32

4266Mbps

1.8/1.1/1.1V

-40°C~95°C

FBGA-200

Mass Production

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K4F6E3S4HM-MGCJ

K4F6E3S4HM-MGCJ

DRAM DDR4

SAMSUNG/三星

16Gb

x32

3733Mbps

1.8/1.1/1.1V

-25°C~85°C

FBGA-200

Mass Production

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K3UH7H70MM-NGCJ

K3UH7H70MM-NGCJ

DRAM LPDDR4X

SAMSUNG/三星

64 GB

x64

3733Mbps

1.8/1.1/0.6V

-25°C~85°C

FBGA-366

Mass Production

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K4EBE304ED-EGCG

K4EBE304ED-EGCG

DRAM LPDDR3

SAMSUNG/三星

32Gb

x32

2133Mbps

1.8/1.2/1.2V

-25°C~85°C

FBGA-178

EOL

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K4EBE304EC-EGCG

K4EBE304EC-EGCG

DRAM LPDDR3

SAMSUNG/三星

32Gb

x32

2133Mbps

1.8/1.2/1.2V

-25°C~85°C

FBGA-178

EOL

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K4E8E324ED-EGCG

K4E8E324ED-EGCG

DRAM LPDDR3

SAMSUNG/三星

8Gb

x32

2133Mbps

1.8/1.2/1.2V

-25°C~85°C

FBGA-178

EOL

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K4E6E304EC-AGCF

K4E6E304EC-AGCF

DRAM LPDDR3

SAMSUNG/三星

16Gb

x32

1866Mbps

1.8/1.2/1.2V

-25°C~85°C

FBGA-168

Mass Production

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K4E6E304ED-EGCG

K4E6E304ED-EGCG

DRAM LPDDR3

SAMSUNG/三星

16Gb

x32

2133Mbps

1.8/1.2/1.2V

-25°C~85°C

FBGA-178

EOL

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K4E6E304EC-EGCG

K4E6E304EC-EGCG

DRAM LPDDR3

SAMSUNG/三星

16Gb

x32

2133Mbps

1.8/1.2/1.2V

-25°C~85°C

FBGA-178

EOL

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K4E6E304EB-EGCF

K4E6E304EB-EGCF

DRAM LPDDR3

SAMSUNG/三星

16Gb

x32

186 Mbps

1.8/1.2/1.2V

-25°C~85°C

FBGA-178

Mass Production

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K4B4G1646E-BYK0

K4B4G1646E-BYK0

DRAM LPDDR3

SAMSUNG/三星

4Gb

512Mx8

1600Mbps

1.35V

0°C~85°C

FBGA-96

Mass Production

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K4B4G0846E-BYMA

K4B4G0846E-BYMA

DRAM LPDDR3

SAMSUNG/三星

4Gb

512Mx8

1866Mbps

1.35V

0°C~85°C

FBGA-78

Mass Production

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K4Z80325BC-HC14

K4Z80325BC-HC14

DRAM GDDR6

SAMSUNG/三星

8Gb

256Mx32

14.0 Gbps

FBGA-180

Mass Production

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K4G80325FC-HC25

K4G80325FC-HC25

DRAM GDDR5

SAMSUNG/三星

8Gb

256Mx32

8.0 Gbps

FBGA-170

EOL

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KLMDG8JEUD-B04Q

KLMDG8JEUD-B04Q

eMMC

SAMSUNG/三星

128GB

1.8/3.3V

-40℃~105℃

FBGA-153

Mass Production

11.5mm x 13mm x 1.2mm

5.1

HS400

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KLMDG8JENB-B041

KLMDG8JENB-B041

eMMC

SAMSUNG/三星

128GB

1.8/3.3V

-25°C~85°C

BGA-153

Archived

11.5mm x 13mm x 1.2mm

5.1

HS400

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