K4B4G0846E-BYMA

K4B4G0846E-BYMA

DRAM LPDDR3

SAMSUNG/三星

4Gb

512Mx8

1866Mbps

1.35V

0°C~85°C

FBGA-78

Mass Production

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K4Z80325BC-HC14

K4Z80325BC-HC14

DRAM GDDR6

SAMSUNG/三星

8Gb

256Mx32

14.0 Gbps

FBGA-180

Mass Production

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K4G80325FC-HC25

K4G80325FC-HC25

DRAM GDDR5

SAMSUNG/三星

8Gb

256Mx32

8.0 Gbps

FBGA-170

EOL

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KLMDG8JEUD-B04Q

KLMDG8JEUD-B04Q

eMMC

SAMSUNG/三星

128GB

1.8/3.3V

-40℃~105℃

FBGA-153

Mass Production

11.5mm x 13mm x 1.2mm

5.1

HS400

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KLMDG8JENB-B041

KLMDG8JENB-B041

eMMC

SAMSUNG/三星

128GB

1.8/3.3V

-25°C~85°C

BGA-153

Archived

11.5mm x 13mm x 1.2mm

5.1

HS400

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KLMDG4UCTA-B041

KLMDG4UCTA-B041

eMMC

SAMSUNG/三星

128GB

1.8/3.3V

-25°C~85°C

FBGA-153

EOL

11.5mm x 13mm x 1.0mm

5.1

HS400

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KLMCG8GESD-B04P

KLMCG8GESD-B04P

eMMC

SAMSUNG/三星

64GB

1.8/3.3V

-40℃~85℃

FBGA-153

Mass Production

11.5mm x 13mm x 1.0mm

5.1

HS400

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KLMCG2UCTB-B041

KLMCG2UCTB-B041

eMMC

SAMSUNG/三星

64GB

1.8/3.3V

-25°C~85°C

BGA-153

Mass Production

11.5mm x 13mm x 0.8mm

5.1

HS400

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KLMCG2KETM-B041

KLMCG2KETM-B041

eMMC

SAMSUNG/三星

64GB

1.8/3.3V

-25°C~85°C

BGA-153

Archived

11.5mm x 13mm x 1.0mm

5.1

HS400

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KLMBG4GEUF-B04P

KLMBG4GEUF-B04P

eMMC

SAMSUNG/三星

32GB

1.8/3.3V

-40℃~85℃

FBGA-153

Mass Production

11.5mm x 13mm x 0.8mm

5.1

HS400

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KLMBG4GESD-B04Q

KLMBG4GESD-B04Q

eMMC

SAMSUNG/三星

32GB

1.8/3.3V

-40℃~85℃

FBGA-153

Mass Production

11.5mm x 13mm x 1.0mm

5.1

HS400

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KLMBG4GESD-B04P

KLMBG4GESD-B04P

eMMC

SAMSUNG/三星

32GB

1.8/3.3V

-40℃~85℃

BGA

Mass Production

11.5mm x 13mm x 1.0mm

5.1

HS400

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KLMBG4GESD-B03P

KLMBG4GESD-B03P

eMMC

SAMSUNG/三星

32GB

1.8/3.3V

-40℃~85℃

BGA-153

Mass Production

11.5mm x 13mm x 1.0mm

5.0

HS400

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KLMBG4GEND-B031

KLMBG4GEND-B031

eMMC

SAMSUNG/三星

32GB

1.8/3.3V

-25°C~85°C

FBGA-153

Archived

11.5mm x 13mm x 1.0mm

5.0

HS400

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KLMBG4GE4A-A001

KLMBG4GE4A-A001

eMMC

SAMSUNG/三星

32GB

2.7V~3.6V

-25°C~85°C

FBGA-169

12mm x 16mm x 1.0mm

4.41

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KLMAG2GESD-B04Q

KLMAG2GESD-B04Q

eMMC

SAMSUNG/三星

16GB

1.8/3.3V

-40℃~105℃

FBGA-153

Mass Production

11.5mm x 13mm x 0.8mm

5.1

HS400

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KLMAG2GESD-B04P

KLMAG2GESD-B04P

eMMC

SAMSUNG/三星

16Gb

1.8/3.3V

-40℃~85℃

FBGA-153

Mass Production

11.5mm x 13mm x 0.8mm

5.1

hS400

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KLMAG1JENB-B041

KLMAG1JENB-B041

eMMC

SAMSUNG/三星

16GB

1.8/3.3V

-25°C~85°C

BGA-153

Archived

11.5mm x 13mm x 0.8mm

5.1

HS400

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KLM8G1WEPD-B031

KLM8G1WEPD-B031

eMMC

SAMSUNG/三星

8GB

1.8/3.3V

-25°C~85°C

BGA-153

Archived

11.5mm x 13mm x 0.8mm

5.0

HS400

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KLM8G1WEMB-B031

KLM8G1WEMB-B031

eMMC

SAMSUNG/三星

8GB

2.7V~3.6V

-25°C~85°C

FBGA-153

11.5mm x 13mm x 0.8mm

5.0

HS400

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