型号
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规格书
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品牌
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容量
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架构
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速率
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工作电压
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工作温度
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产品详情
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K4ZAF325BM-HC16 |
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K4ZAF325BM-HC16 |
DRAM GDDR6 |
SAMSUNG/三星 |
16Gb |
512Mx32 |
16.0Gbps |
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FBGA-180 |
EOL |
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点击查看 |
KLMDG4UCTB-B041 |
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KLMDG4UCTB-B041 |
eMMC |
SAMSUNG/三星 |
128GB |
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1.8/3.3V |
-25°C~85°C |
BGA |
Mass Production |
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11.5mm x 13mm x 1.0mm |
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5.1 |
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HS400 |
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点击查看 |
K4ABG165WB-MCWE |
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K4ABG165WB-MCWE |
DRAM DDR4 |
SAMSUNG/三星 |
32Gb |
2Gx16 |
3200Mbps |
1.2V |
0°C~85°C |
FBGA-96 |
Mass Production |
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点击查看 |
K4ABG085WA-MCTD |
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K4ABG085WA-MCTD |
DRAM DDR4 |
SAMSUNG/三星 |
32Gb |
4Gx8 |
2666Mbps |
1.2V |
0°C~85°C |
FBGA-78 |
Mass Production |
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点击查看 |
K4AAG165WB-MCTD |
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K4AAG165WB-MCTD |
DRAM DDR4 |
SAMSUNG/三星 |
16Gb |
1Gx16 |
2666Mbps |
1.2V |
0°C~85°C |
FBGA-96 |
Mass Production |
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点击查看 |
K4AAG165WB-BCWE |
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K4AAG165WB-BCWE |
DRAM DDR4 |
SAMSUNG/三星 |
16Gb |
4Gx4 |
3200Mbps |
1.2V |
0°C~85°C |
FBGA-78 |
Mass Production |
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点击查看 |
K4AAG165WA-BIWE |
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K4AAG165WA-BIWE |
DRAM DDR4 |
SAMSUNG/三星 |
16Gb |
1Gx16 |
3200Mbps |
1.2V |
-40°C~95°C |
FBGA-96 |
Mass Production |
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点击查看 |
KLUDG8J1ZD-C0CP |
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KLUDG8J1ZD-C0CP |
UFS |
SAMSUNG/三星 |
128GB |
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1.8/3.3V |
-40°C~95°C |
BGA |
Mass Production |
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11.5mm x 13mm x 1.2mm |
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2.1 |
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G3 2Lane |
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点击查看 |
KLUDG8J1ZD-C0CQ |
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KLUDG8J1ZD-C0CQ |
UFS |
SAMSUNG/三星 |
128GB |
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1.8/3.3V |
-40℃~105℃ |
BGA |
Mass Production |
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11.5mm x 13mm x 1.2mm |
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2.1 |
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G3 2Lane |
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点击查看 |
KLUCG4J1ZD-C0CP |
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KLUCG4J1ZD-C0CP |
UFS |
SAMSUNG/三星 |
128GB |
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1.8/3.3V |
-40°C~95°C |
BGA |
Mass Production |
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11.5mm x 13mm x 1.2mm |
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2.1 |
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G3 2Lane |
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点击查看 |
KLUCG4J1ZD-C0CQ |
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KLUCG4J1ZD-C0CQ |
UFS |
SAMSUNG/三星 |
32GB |
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1.8/3.3V |
-40°C~95°C |
BGA |
Mass Production |
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11.5mm x 13mm x 1.2mm |
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2.1 |
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G3 2Lane |
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点击查看 |
KLMCG4JEUD-B04P |
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KLMCG4JEUD-B04P |
eMMC |
SAMSUNG/三星 |
64GB |
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1.8/3.3V |
-40℃~85℃ |
BGA |
Mass Production |
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11.5mm x 13mm x 1.2mm |
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5.1 |
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HS400 |
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点击查看 |
KLMBG4GEUF-B04Q |
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KLMBG4GEUF-B04Q |
eMMC |
SAMSUNG/三星 |
32GB |
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1.8/3.3V |
-40℃~105℃ |
BGA |
Mass Production |
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11.5mm x 13mm x 0.8mm |
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5.1 |
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HS400 |
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点击查看 |
KLM8G1GEUF-B04Q |
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KLM8G1GEUF-B04Q |
eMMC |
SAMSUNG/三星 |
8GB |
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1.8/3.3V |
-40℃~105℃ |
BGA |
Mass Production |
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11.5mm x 13mm x 0.8mm |
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5.1 |
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HS400 |
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点击查看 |
K4UJE3Q4AA-TFCL |
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K4UJE3Q4AA-TFCL |
DRAM LPDDR4X |
SAMSUNG/三星 |
48Gb |
x32 |
4266Mbps |
1.8/1.1/0.6V |
-40°C~95°C |
FBGA-200 |
Mass Production |
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点击查看 |
K4UJE3Q4AA-THCL |
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K4UJE3Q4AA-THCL |
DRAM LPDDR4X |
SAMSUNG/三星 |
48Gb |
x32 |
4266Mbps |
1.8/1.1/0.6V |
-40℃~105℃ |
FBGA-200 |
Mass Production |
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点击查看 |
K4UBE3D4AM-TFCL |
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K4UBE3D4AM-TFCL |
DRAM LPDDR4X |
SAMSUNG/三星 |
32Gb |
x32 |
4266Mbps |
1.8/1.1/0.6V |
-40°C~95°C |
FBGA-200 |
Mass Production |
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点击查看 |
K4UBE3D4AM-THCL |
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K4UBE3D4AM-THCL |
DRAM LPDDR4X |
SAMSUNG/三星 |
32Gb |
x32 |
4266Mbps |
1.8/1.1/0.6V |
-40℃~105℃ |
FBGA-200 |
Mass Production |
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点击查看 |
K4FBE3D4HM-TFCL |
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K4FBE3D4HM-TFCL |
DRAM LPDDR4 |
SAMSUNG/三星 |
32Gb |
x32 |
4266Mbps |
1.8/1.1/1.1V |
-40°C~95°C |
FBGA-200 |
Mass Production |
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点击查看 |
K4FBE3D4HM-GFCL |
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K4FBE3D4HM-GFCL |
DRAM LPDDR4 |
SAMSUNG/三星 |
32Gb |
x32 |
3733Mbps |
1.8/1.1/1.1V |
-40°C~95°C |
FBGA-200 |
Mass Production |
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点击查看 |